L4000mm*W400mm*T40mm with hole or step Si+Cu bonding metal sputtering target
Short Description:
- vacuum melting process&HIP
- high purity99.99%~99.999%
- good compactness>99% (no porosity)
- uniform grain size
- surface 3.2Ra
- competitive price and fast delivery
Product Detail
Product Tags
Product Specifications
arc Dia100*40mm
rectangle/planar L4000mm*W400mm*T40mm,with hole or step
cylinder: rotary target L3987*ID125*OD159mm,L3191*ID125*OD159mm
Bonding on copper backing plate
powder,granule
customized by drawing
Logistics Information
vacuum PVC bag for each pice,PE and fumigation wood box package.
Application
1:The flat panel Display coating industry
2: Tools&Decoration Coating industry
3: Architectural glass / automotive glass industry
4:Optical data /Magnetic data storage industry
5:Optical communication industry
6:Solar PV and Heating industry
